Emerson adds Liebert 'smart modules' for high density cooling efficiency - Cabling Installation & Maintenance

Emerson adds Liebert 'smart modules' for high density cooling efficiency


Jun 17, 2009

June 17, 2009 -- Emerson Network Power has enhanced its Liebert XD family of high heat density cooling products with the addition of the Liebert XD Smart Modules, cooling modules upgraded with integrated control boards to enable higher efficiency performance.

According to the company, the Smart Modules reduce energy consumption by controlling cooling fans based on the cooling load at each individual module. The Smart Modules are supported by the Liebert XDP pumping unit, which has been upgraded with the Liebert iCOM control system to improve system monitoring and control.

The new modules are available on Liebert XDV rack-mount, Liebert XDH in-the-row, and Liebert XDO ceiling-mount cooling modules. These cooling modules use pumped refrigerant for optimal use around electronic equipment. According to the company, all modules work together to provide high heat density cooling at the source of the heat, and work well in hot aisle/cold aisle configurations with room-based precision cooling. With the addition of Liebert XD Smart Modules, the system achieves greater energy efficiencies through optimized cooling fan operation of multi-fan modules.

The Liebert XDP pumping unit acts as an interface between the pumped refrigerant circuit and the building chilled water system. The addition of the Liebert iCOM control system to this unit allows all key functions to be continually monitored. The iCOM system includes slots for two Web-compatible and building management system (BMS) cards for integration into an infrastructure management or building management system for alarm management and notification. The iCOM control system also increases reliability and serviceability by recording maintenance history and allowing spare parts lists to be stored and easily accessed by maintenance personnel.

"The Liebert XD system is a proven solution for high density cooling of rack-based IT equipment. It enables higher equipment densities while reducing cooling costs by up 32 percent," comments Bob Blough, director, product marketing, Liebert precision cooling, Emerson Network Power. "By increasing the intelligence of the system through the addition of the Liebert Smart Modules and Liebert iCOM system, we are continuing to reduce costs of data center operation while maximizing equipment performance and availability."

On the Web:
www.liebert.com
www.emersonnetworkpower.com


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