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Sep 30, 2009
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Tom Turner, Business Development Manager, Panduit
Kevin Paschal, Senior Product Manager, Enterprise Fiber Optic Solutions, CommScope, Inc. Jonathan Jew, President, J&M Consultants Paul Kish, Director, Systems and Standards, Belden |
TIA Standards Update III
Across many network and user types, the need for higher speeds and increased bandwidth continues even in these globally challenging economic times. Networks are getting larger and faster, and the infrastructure to support those networks must be more powerful and agile than ever before. The Telecommunications Industry Association's TR-42 Engineering Committee develops the cabling specifications that are the bedrock of system performance. This web-delivered seminar produced by Cabling Installation & Maintenance provides some of the latest information to come out of the subcommittees and groups within TR-42, charting the course of the industry's standards-making body.
Presentation 1: OM4 multimode fiber
Development of performance specifications for OM4 multimode optical fiber continue within the TIA's TR-42.8 subcommittee. This presentation will update the status of those specifications, and also describe recent activity within the IEEE to recognize OM4 fiber as a medium for 40- and 100-Gbit Ethernet standards currently under development.
Presentation 2: Cabling and components balance
A group within the TR-42.7 subcommittee is hard at work on specifications for the all-important twisted-pair cabling performance characteristic of balance. This presentation provides an overview of the group's activities, explaining the reasons this issue came up for consideration as well as the work that has been done toward a draft specification.
Presentation 3: The 606-B administration standard
This report from the TR-42.6 subcommittee will detail the current state of the TIA/EIA-606-B administration standard, commonly referred to as the "labeling standard." In addition to describing the 606-B specifications under development, this presentation will also refer to other standards that relate to 606-B, potentially including the TIA's 942 standard for data center infrastructure and the ISO/IEC 14763-2-1.
Presentation 4: Grounding and bonding specifications
The ambitious TR-42.16 committee continues to move quickly and steadily toward a revision of the 607 standard for grounding and bonding telecommunications systems. This presentation charts the progress of that group, explaining the milestones that have been reached already and the issues still under study and discussion.
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Tom Turner
Business Development Manager Panduit |
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Kevin Paschal
Senior Product Manager, Enterprise Fiber Optic Solutions CommScope, Inc. |
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Jonathan Jew
President J&M Consultants |
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Paul Kish
Director, Systems and Standards Belden |
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Panduit is a world-class developer and provider of leading-edge solutions that help customers optimize the physical infrastructure through simplification, agility and operational efficiency. Panduit’s Unified Physical Infrastructuresm (UPI) based solutions give enterprises the capabilities to connect, manage and automate communications, computing, power, control and security systems for a smarter, unified business foundation. Strong relationships with technology leaders complemented with its global staff and unmatched service and support make Panduit a valuable and trusted partner.
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