Ethernet Alliance to host 100-GbE tech exploration forum
Upcoming event will examine drivers for next generation interconnect specifications.
The Ethernet Alliance will host a Technology Exploration Forum (TEF) on June 14 in Santa Clara, Calif, dedicated to examining the future of next generation 100 Gigabit Ethernet interconnect specifications. The one-day event will bring together experts from across the Ethernet industry to share perspectives on the market drivers for 100 Gigabit Ethernet and discuss key areas for development, including 100 Gigabit backplane and copper cabling, optics and next generation BASE-T.
According to the Ethernet Alliance, as industry demand for 100 Gigabit Ethernet continues to grow, support for the development of additional interconnect specifications is rapidly increasing. The IEEE 802.3 Working Group has already initiated a study group to examine 100 Gigabit Ethernet operation across an electrical backplane and a narrower twin-axial copper cable interface and will also consider a new effort focused on the next generation of 100 Gigabit optical interfaces at its July, 2011 meeting. In light of these efforts, this TEF offers a great opportunity for attendees to join the discussion as industry debate is just getting underway.
Featured discussions at the TEF will cover:
-- The IEEE 802.3 100 Gigabit Backplane and Copper Cable Study Group: Discussion will focus on backplane and cable reach, signaling technologies, channel options and Energy Efficient Ethernet.
-- Next Generation 100 Gigabit Single Mode Fibre Optics: Discussion will focus on issues to be considered for specification inclusion, including the possibility of a 4x25 electrical interface solution.
-- The Future of Optical Interconnects: Discussion will center around the ongoing debate over electrical vs. optical interconnects with special focus on bandwidth requirements and power concerns.
“The ratification of IEEE Std 802.3ba-2010 was just the beginning of 100 Gigabit Ethernet,” said John D’Ambrosia, Chair of the Ethernet Alliance Board of Directors and chair of the IEEE 802.3 100 Gigabit Ethernet Electrical Backplane and Twinaxial Copper Cable Assembly Study Group. “The next generation of networks will look at deployment of 10, 40, and 100 Gigabit Ethernet. Further work on interconnect specifications for 100 Gigabit Ethernet is needed and starting now. The Ethernet Alliance is supporting this work through activities like the TEF to help bring the industry together to discuss the key technical decisions that will need to be resolved. Given activities within the IEEE, this event is extremely timely for those interested in contributing to the development of these emerging technologies.”
Sponsored by Broadcom, Opnext and TE Connectivity, the TEF is designed to foster industry discussion. The Ethernet Alliance invites anyone interested in the Ethernet industry to attend and share their perspective on 100 Gigabit Ethernet.