Molex is showcasing its new series of EMI cages at the 25th annual Supercomputing 2013 (SC13) international conference, November 18-21, at Denver's Colorado Convention Center. A key component of the Molex zQSFP+ Interconnect Solution, the cages are assembled with zQSFP+ SMT connectors to create the interconnect solution and are offered in 1-by-4 ganged and 1-by-6 ganged versions.
The EMI cages feature an advanced heat-sink system that provides a high level of heat dissipation at next-generation system-power levels, as well as a die-cast frame design with reduced holes and openings that offers optimal EMI suppression and shielding effectiveness. The cages also have a screw-down feature to the PCB for maximum board retention for both single-side and belly-to-belly applications.
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The EMI cages have the same mechanical mating size as QSFP+ EMI cages, which provide backward compatibility with QSFP+ and QSFP+ modules and cage assemblies for legacy system connections. “Pervasive bandwidth requirements, due to the tremendous growth in wireless devices, are the catalyst for large-scale (100 Gbps) system designs in server farms,” comments Alan Johnston, product manager, Molex. “zQSFP+ connectors transmit up to 25 Gbps per-serial-lane data rates with excellent signal integrity, relieving some of the pressure on core switches.”
The zQSFP+ Interconnect Solution and EMI cages are part of Molex's product line for supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications. The total platform transmits up to 25 Gbps per-serial-lane data rates with excellent signal integrity, electromagnetic interference protection and thermal cooling, says the company. During SC13 exhibition hours, Molex industry experts will be on hand to discuss these and other next-generation solutions at the company's booth #1141.
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