Optoscribe, Sumitomo collaborate on multicore fiber for datacom, telecom

Optoscribe's 3D glass-based photonic integrated circuits combine embedded waveguides and high precision micromachining for applications ranging from data center optical transceiver interconnects, to fiber connectivity and consumer electronics.

Optoscribe, Sumitomo collaborate on multicore fiber for datacom, telecom
Optoscribe, Sumitomo collaborate on multicore fiber for datacom, telecom

Optoscribe (Livingston, UK), which supplies 3D glass-based integrated photonics components, and Sumitomo Electric Industries (Osaka, Japan), which produces optical fiber cable and component manufacturing technology supplier, on Feb. 19 announced the formation of a strategic cooperation to provide multicore fiber (MCF) components for datacom and telecom applications.

Optoscribe, formed in 2010, has developed laser direct-write technology to manufacture glass-based integrated 3D photonic components for the telecommunications and data communications markets; and specifically, for four core (or greater) MCF with fan-in/fan-out components based on 3D glass-based photonic technology in datacom applications where ultra high-density optical interconnection is required.

Optoscribe's 3D glass-based photonic integrated circuits combine embedded waveguides and high precision micromachining for applications ranging from data center optical transceiver interconnects, to fiber connectivity and consumer electronics.

The companies say the strategic cooperation will seed the market for practical use cases of Sumitomo Electric's MCF interconnects.

"We see this as a great opportunity to jointly address the performance challenges faced by datacom and telecom applications, while creating and fostering the supply chain for further deployment of multicore fiber and related technologies," commented Nick Psaila, Optoscribe's CEO.

For more on both companies, visit:

https://global-sei.com/fiber_optic_interconnect/

https://www.optoscribe.com

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