10G connector systems offer blind mating flexibility

ERNI's  MicroSpeed shielded signal pins are optimized for high impedance signal transmissions. Blind mating supports applications where ruggedness and flexibility are necessary.

Content Dam Cim Online Articles 2012 October Erni Microspeed

In German manufacturer ERNI's new MicroSpeed high-speed board-to-board interconnect system, signal pins rows in the board-to-board configuration are shielded on the perimeter of the connector body and can be optimized for high impedance signal transmissions. The MicroSpeed connector system is also available in blind mating versions for demanding 10Gbps applications where ruggedness and flexibility are necessary.

The board-to-board connector system has a 1.0 mm pitch and is capable of speeds up to 10Gbps. Systems are available in mezzanine, right angle and coplanar configurations. “The MicroSpeed connector is unlike other products on the market in that its female contacts incorporate two points of contact, ensuring reliability and a unique design that guarantees up to 500 mating cycles,” explains Sam Hines, product coordinator at ERNI.

Hines adds, “The availability of this connector system in three different configurations also allows for engineers to replace existing connectors in a number of different devices with this superior design.”

The open-pin field design of the MicroSpeed connector can accommodate differential or single-ended signals, while maintaining maximum performance speed, notes ERNI. An added security measure for system integration is afforded by the generous mis-mating allowances of the unique contact design, which provides a longitudinal misalignment tolerance of +/- 0.7mm and angular misalignment tolerance of up to four degrees.

PDF Data Sheet:MicroSpeed 1.0 mm High Speed Mezzanine Connector System for 10 GBit/s

The MicroSpeed connector system also yields excellent RF signal characteristics. The rows of signal pins in the board-to-board configuration are shielded on the perimeter of the connector body and can be optimized for high impedance signal transmissions. The connector system is also available in blind mating versions for demanding applications where ruggedness and flexibility are necessary. Guide elements in the plug side and improved lead-in for receptacle mating insures proper alignment and secure connections on the first attempt.

The ERNI Microspeed connectors are available in both SMT and SMT/THR termination styles. The SMT/THR style uses traditional SMT contacts but THR for the perimeter shield, which provides excellent board retention/strain relief should the application require high stack heights, or if the connector is integrated within a system of heavy daughter cards. The connector body incorporates polarized board locating pegs for easy, error-free placement and processing.

ERNI leads are formed as an integral part of the stamping die, as opposed to other leads that are bent and stamped for SMT termination. This process guarantees coplanarity of 0.1 mm and virtually eliminates processing defects. MicroSpeed connector systems are available in board-to-board with 50, 91, and 133 positions; and in mezzanine configurations with stack heights from 5 mm to 20 mm in 1 mm increments. Typical pricing starts at $6.00 for a 50-position connector with a lead time of six weeks.

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