January 6, 2009 -- The system features the patented iPass connector, which is designed specifically for high-density applications.
ModLink is a custom pre-terminated high-density plug and play modular copper solution that is 100% factory tested. It features the patented iPass connector, a low-profile slim line I/O designed specifically for high-density applications.
The connector is made from die-cast zinc alloy and has a narrow latch-pull design that enables swift and positive connect or disconnect. The connector accommodates a 24-pair cable and the overall cable diameter is significantly less than that of multiple RJ-45 cables used in traditional systems, assisting with airflow and cooling in cable-dense applications.
Each ModLink cassette supports 6 or 12 RJ-45 ports in a 2-row format, and slides in and out of the panels, allowing fast installations in switch or server applications. The cassettes are designed to offer Gigabit Ethernet performance while reducing rack space.
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