OIF announced it will host its largest global interoperability showcase during ECOC 2022, September 19-21, in Basel, Switzerland. OIF said nearly 30 member companies are participating in ECOC demonstrations this year in four critical areas including: 400ZR optics; co-packaging architectures; Common Electrical I/O (CEI) architectures; and Common Management Interface Specification (CMIS) implementations. OIF experts will also participate in the "Market Focus" program at ECOC, discussing the consortium's work in CMIS in one session, which defines current and future generations of management control for optical and copper modules, and a second session addressing the successful development of 400ZR optics, and OIF’s work to define 800ZR/LR.
The interoperable optical networking solutions demo—live and static—at ECOC will feature 28 OIF member companies—a record number of participants, including: Alphawave IP; Amphenol; Applied Optoelectronics Inc.; Cadence Design Systems; Ciena; Cisco; Corning; Credo; EXFO; Fujitsu Optical Components; Juniper Networks, Inc.; Keysight Technologies; Lumentum; Marvell; MaxLinear, Inc.; Microchip Technology Incorporated; Molex; MultiLane, Inc.; Nokia; O-Net Communications; Senko Advanced Components Inc.; Sumitomo Electric Industries, Ltd.; Synopsys, Inc.; TE Connectivity; US Conec; VIAVI Solutions Inc.; Wilder Technologies and Yamaichi Electronics.
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“The high level of participation in this year’s interoperability demonstration at ECOC demonstrates the global importance of OIF’s work and the collective efforts of its members to showcase how their solutions establish an ecosystem and work together to drive implementation of next-generation capabilities." -- Mike Klempa, Alphawave IP Group, OIF Physical & Link Layer Interoperability Working Group Chair.
400ZR demo
In a press release, OIF said its 400ZR project is proving successful in facilitating new and simplified architectures for high bandwidth inter-data center interconnects and promoting interoperability among coherent optical module manufacturers. The 400ZR interop demo at ECOC shows a full implementation across an 80km DWDM ecosystem using multiple form-factor pluggable modules, 400GbE routers, 75 GHz C-band open line system, and test equipment solutions from multiple vendors. The demo provides evidence of widescale 400ZR deployment readiness based on a broad ecosystem of interoperable solutions.
Co-packaging demo
While individual companies consider options to optimize power and density, OIF said it has seen the need to lead industry standardization discussions for co-packaging architectures that promise to reduce power consumption and increase bandwidth edge density. OIF contends it is leading the industry’s interoperability discussions for co-packaging solutions and will showcase its progress with multi-party demonstrations of its 3.2T Module project and External Laser Small Form Factor Pluggable project (ELSFP). A variety of interoperable components that enable co-packaging will be shown, along with a system implementation.
Common Electrical I/O (CEI) demo
OIF notes it played a lead role in moving the industry to the next generation by developing electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability amongst 14 participating members prove the critical role OIF serves as well as the developing supplier ecosystem. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over various channels, including mated compliance boards, PCB channels, direct attach copper cable channels, a cabled backplane and even fiber. Each configuration demonstrates the technical viability of 112 Gbps operation, along with multiple industry form factors, including OSFP and QSFP-DD. The demo also shows a measured far-end eye diagram on an oscilloscope with analysis to show an example of the silicon signal integrity that is typically required going through the large variety of channels on display. Also, as the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224 Gbps per lane, new specifications and technologies will be required. OIF said it is leading the charge on 224G hardware interconnection application spaces and definitions, unveiling publicly at ECOC the first live 224G demo.
Common Management Interface Specification (CMIS) Implementations demo
CMIS is now established as the management interface of choice for next-generation pluggable modules, capable of managing both simple and advanced modules. CMIS provides a well-defined common mechanism to initialize and manage optical and copper modules while still providing the ability to support custom functionality. This commonality makes integration into different host platforms easier for both the host vendor and the module vendor. The CMIS demo at ECOC consists of four separate demonstrations that show how modules can be managed and initialized, how modules can support multiple independent services (breakout) and how module firmware can be easily upgraded.