Ethernet Alliance emphasizes HPC multivendor interoperability at SC22

Nov. 8, 2022
Ethernet Alliance says the HPC market is driving the mandate for high-speed Ethernet technology with longer-distance connections.

The Ethernet Alliance today announced its participation in SuperComputing (SC22), the international conference for the high performance computing (HPC), networking, storage, and analysis industry, being held in Dallas, Texas from November 14 - 17.

The theme of SC22 is “HPC Accelerates,” a name highlighting how new avenues of exploration and thought surrounding scientific discovery and product development are opening up far-reaching applications through HPC technology.

Hosting a kiosk in the SC22 Open Standards Pavilion (Booth #2840), the Ethernet Alliance, the global consortium dedicated to fostering the advancement of Ethernet technologies, will be promoting the commercial and end user benefits of multivendor Ethernet interoperability, needed to further HPC technology acceleration.

As noted by the Ethernet Alliance's announcement:

The HPC market is driving the mandate for high-speed Ethernet and longer distance connections. Power draw, heat dissipation, cost to connect, and cross-platform functionality are a few of the key considerations the industry is addressing in support of the market.

Nearly 50 years after its inception, Ethernet has evolved into a commanding presence in high performance computing, providing HPC designers the flexibility and scalability necessary to develop innovative, custom-built solutions while enjoying the robust reliability and advantages that Ethernet delivers.

David J. Rodgers, Ethernet Alliance events and conference chair and senior technical business development manager at test equipment specialist EXFO, commented:

“The interoperability demonstrations hosted by Ethernet Alliance for the OFC and ECOC shows earlier this year illuminated the critical role multivendor interoperability plays in the burgeoning 800G ecosystem. As the voice of Ethernet representing the global Ethernet ecosystem, we are committed to helping manufacturers provide the HPC market with an array of best-in-class solutions, from the component and system level, to test and measurement, and beyond.”

SC22 attendees can engage with Ethernet Alliance members in the event's Open Standards Pavilion and gain access to information and materials, such as the 2022 Ethernet Roadmap, which lays out key application spaces for Ethernet technology including those for the Automotive, Enterprise, Service and Cloud Provider, and Automation, Building and Industrial segments.

Member companies participating in the Ethernet Alliance kiosk in the SC22 Open Standards Pavilion include Amphenol, EXFO, The Siemon Company, TE Connectivity, and Teledyne LeCroy.

Learn more about SC22 and the Ethernet Alliance’s involvement in the event. 

QUOTES

“Amphenol, one of the largest manufacturers of interconnect products in the world, is excited to partner with the Ethernet Alliance at SC22. With the rapid advances of the Ethernet ecosystem partnering with Ethernet Alliance is a very effective way to highlight the latest advances in Ethernet to super computing and the world. As a member of the Ethernet Alliance, we are proud to participate in the information booth at this event.” – Chris Lyon, Cloud NBD Amphenol business development manager – Americas

“The challenges integrating products into the HPC networking closet, moving from 25Gb/s and 50Gb/s to 100Gb/s signaling rates, are exponential. Interop testing requires the new 100Gb/s products to work between other similar rate offerings, but also back-rate testing is needed across the range of IEEE 802.3 speeds. The ongoing commitment of the Ethernet Alliance members is to ensure interoperability reaches across all corners of the ecosystem, and that bodes well for the future of HPC.” – David J. Rodgers, events and conference chair, Ethernet Alliance Board of Directors, and senior technical business development manager, EXFO

“We are excited to be exhibiting at SuperComputing 2022 with the Ethernet Alliance. Siemon will be highlighting rack integration cabling solutions for 10GbE, 25GbE, 40GbE, 100GbE, and beyond. The Siemon Company is a participating member of the Ethernet Alliance. We recently submitted next generation, 400GbE and 200GbE, direct attach copper and active optical cables for interoperability and performance compliance to the 802.3cd (50 Gb/s per lane) industry standard. Siemon’s future QSFP56-DD and QSFP56 cable assemblies support emerging data center inner rack connectivity. These next generation cable assemblies expand on Siemon’s offering of network access–rack integration cabling solutions. I look forward to talking about what’s new and reviewing all the options available when considering 3rd party Ethernet cabling solutions.” – Ryan J. Harris, Market Manager, High Speed Cable Assemblies, The Siemon Company

“As a founding principal member of the Ethernet Alliance, TE Connectivity is proud to participate in the Ethernet Alliance kiosk at the international conference for high performance computing, networking, storage, and analysis, better known as the SuperComputing (SC22) show, in 2022. TE has a long history of advancing Ethernet connectivity’s performance capabilities in support of HPC (high performance computing) and this year is no exception. As HPC performance levels increase in each generation, TE must also develop technology that allows us to provide improved solutions. Participating with the Ethernet Alliance at SC22 gives us the opportunity to continue to communicate with our customers and meet their needs.” – Nathan Tracy, technologist and manager of industry standards, TE Connectivity

“As Ethernet advances towards terabit per lane speeds, the task of assuring interoperability and integrity in the network is both exciting and challenging. High performance computing requires the fastest network infrastructure available, and the growing interaction between on-prem and Cloud HPC places a premium on high speed network interoperability. We are happy to be participating with the Ethernet Alliance at SC22 this year to showcase Teledyne’s solutions for HPC in these environments.” – Nick Kriczky, VP of products and services, Teledyne LeCroy

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About the Author

Matt Vincent | Senior Editor

Matt Vincent is a B2B technology journalist, editor and content producer with over 15 years of experience, specializing in the full range of media content production and management, as well as SEO and social media engagement best practices, for both Cabling Installation & Maintenance magazine and its website CablingInstall.com. He currently provides trade show, company, executive and field technology trend coverage for the ICT structured cabling, telecommunications networking, data center, IP physical security, and professional AV vertical market segments. Email: [email protected]

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