Per an article by IEEE Spectrum, xMEMS has changed its ultrasonic microelectromechanical (MEMS) “fan-on-a-chip” to fit inside a pluggable optical transceiver so it pushes air through and cools the digital signal processor (DSP), the transceiver’s primary digital part. In the article the interviewed Thomas Tarter, principal thermal engineer at startup xMEMS Labs, stated that it is imperative to keep the DSP cool for its longevity. Not only can colling improve the tranceivers’ signals, it’s also saves money through the extended use out of a $2,000+ transceiver.
Although the MEMS cooler originally seemed unable to match the liquid cooling systems solutions in data centers, Mike Housholder, xMEMS vice president of marketing, commented that the company was still approached by data-center customers.
While working with partners xMEMS would not name, the company began looking into how to get air flowing through the transceiver. Although these parts typically utilize 18+ watts, by fixating the company’s MEMS chip within an airflow channel that is physically isolated but still thermally connected to the transceiver chips, xMEMS anticipates it will be able to lower the DSP’s temperature over 15 percent.
“xMEMS has been making prototype MEMS chips at Stanford’s nanofabrication facility, but it will have its first production silicon from TSMC in June, says Housholder. The company expects to be in full production in the first quarter of 2026. ‘That aligns well with our early customers,’ he says.”
