Panduit Introduces Direct-to-Chip Cooling System for AI Data Centers
Panduit recently launched the Direct-to-Chip (DTC) Cooling System, which the company characterizes as “an advancement in liquid cooling technology engineered for high-density AI and High Performance Computing environments,” adding that the “Panduit DTC accelerates deployment, reduces installation risk, and delivers scalable thermal management within a standard cabinet footprint.”
The DTC Cooling Systems includes FlexFusion cabinets and rack manifolds that work together to deliver uniform, leak-free liquid cooling directly to the chip, Panduit explains. The system’s features include the following.
- Movable e-rails and split-hinged doors for simplified buildouts
- Electrically bonded steel frames for structural integrity
- Quick-connect manifolds with automatic air exhaust vales for fast, error-free installation
- A standard cabinet footprint, with no rear extensions or retrofitting required
Panduit says the system’s design enables data center operators to deploy high-density AI servers without compromising space, speed, or reliability. The system complements the company’s existing Rear Door Heat Exchanger (RDHx) offering.
The FlexFusion DTC Integrated DTC Cooling Cabinet is available in heights of 48 and 52 RU, with 750-mm width and 1200-mm depth. Panduit says, “The DTC Cooling Cabinet includes a front single-hinged door and rear split-hinged doors with 80% open perforation, horizontally split side panels, PDU mounting bracket, and casters. The entire cabinet is electrically bonded without the use of bonding wires.” The cabinet has a 5600-pound static load rating and 4000-pound rolling load rating. Furthermore, the cabinet “takes advantage of underutilized space … This space can be used to mount the manifolds or the PDUs, providing maximum flexibility when deploying DTC-cooled servers. This flexibility reduces the time to deploy DTC cooling solutions and reduces installation errors. The DTC Cooling Cabinet removes the need to ad a caboose to the rear of the cabinet to gain extra space; this frees up 200 mm in the depth of the cabinet/caboose, simplifies deployment, and reduces cost.”
The Rack Manifold “efficiently supplies water for liquid-cooled servers and returns the heated water to a cooling distribution unit,” Panduit adds. “The unique design of the DTC Cooling Cabinet and rack manifold maximizes the amount of usable space in the rear of the cabinet. This extra space makes it easier to outfit AI and HPC cabinets with liquid cooling manifolds, multiple PDUs, power cords, and fiber-optic cabling management, thereby shortening deployment time and reducing errors.
“The manifold consists of a supply pipe and a return pipe, used for uniformly supplying and returning liquid to the server. The body is made of SUS304 material, and the inlets and outlets are equipped with leak-free quick connectors, enabling rapid connection and disconnection. An automatic exhaust valve is installed above each manifold, allowing for effective exhaust of air in the system.”
“Our DTC Cooling System reflects Panduit’s commitment to solving real-world infrastructure challenges with smart, scalable solutions,” said David Weksel, director of strategic growth of Panduit Ventures. “This launch marks a major step forward in enabling AI-ready environments that are efficient, reliable, and future-proof.”
You can find more information on Panduit’s DTC Cooling System here.