Dielectric epoxy

Dec. 1, 1997
The solvent-free and thermally conductive tra-bond 2158 dielectric epoxy is used for bonding heat-sensitive components or substrates. The epoxy bonds to most metals, ceramics, glass, silica, and plastics. It cures overnight at room temperature or within 2 to 4 hours at 65oC and is resistant to salt solutions, mild acids/bases, and cleaning solutions.

The solvent-free and thermally conductive tra-bond 2158 dielectric epoxy is used for bonding heat-sensitive components or substrates. The epoxy bonds to most metals, ceramics, glass, silica, and plastics. It cures overnight at room temperature or within 2 to 4 hours at 65oC and is resistant to salt solutions, mild acids/bases, and cleaning solutions.

TRA-CON Inc.

Bedford, MA

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