Metalink unveils plans to develop wireless LAN product line

July 31, 2003
July 31, 2003 - WLANPlus is designed to surpass the speed of existing technology.

Metalink has unveiled a strategic plan to expand the company's product offering to include innovative products serving the wireless LAN market.

The company announced that it is developing a wireless LAN technology, WLANPlus, capable of increasing the speed more than five fold in comparison to the now available wireless LAN 802.11x technology.

"Metalink has been developing its WLANPlus technology over the last 18 months, as a part of our strategic effort to expand our VDSL leadership to synergetic, rapidly-growing, broadband markets," says Tzvi Shukhman,
Metalink's chairman and CEO. "We are excited to participate in the rapidly-emerging wireless LAN market."

Metalink will demonstrate its WLANPlus technology to potential alpha customers in the fourth quarter of this year. WLANPlus is designed to meet the increasing demand for wireless LAN speed and reach, critical for home and office multi-media applications. WLANPlus' architecture features multiple antennas and utilizes
advanced communication techniques such as space-time coding, in order to dramatically improve speed and reach.

The technology is designed to be backward compatible with available 802.11x standards and supports recent improvements in Quality of Service and security. WLANPlus chipsets are designed to be price-competitive with 802.11x chipsets.

"The concept of sending data, video and audio content wirelessly seems to be the near-term future of networking information and distributed computing,"
predicts Vamsi Sistla, Allied Business Intelligence (ABI) senior analyst.

"Worldwide revenues of WiFi and other wireless chipset shipments for A/V applications will reach anywhere between $170 million to $290 million in the year 2004 and beyond."

Metalink is based in Yakum, Israel. For more information visit
www.metalink.co.il.

Sponsored Recommendations

imVision® - Industry's Leading Automated Infrastructure Management (AIM) Solution

May 29, 2024
It's hard to manage what you can't see. Read more about how you can get visiability into your connected environment.

Adapt to higher fiber counts

May 29, 2024
Learn more on how new innovations help Data Centers adapt to higher fiber counts.

Going the Distance with Copper

May 29, 2024
CommScopes newest SYSTIMAX 2.0 copper solution is ready to run the distanceand then some.