Ortronics unveils grounding, bonding solutions

Sept. 2, 2008
September 2, 2008--Ortronics/Legrand, a developer of high performance copper, fiber and wireless structured cabling solutions, has introduced a new bonding and grounding product line.

September 2, 2008--Ortronics/Legrand, a developer of high performance copper, fiber and wireless structured cabling solutions, has introduced a new bonding and grounding product line. The solutions, which are designed to protect
the performance and safety of sensitive network equipment, and for enhancing personal protection, are UL-listed and meet ANSI-J-STD-607-A standards.

On the Web: www.ortronics.com

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