The Telecommunications Industry Association has announced that the 2004 China-United States Telecommunications Summit will take place June 17-19 in Chicago.
The 2004 summit is co-sponsored by the U.S. Department of Commerce's National Telecommunications and Information Administration (NTIA) and International Trade Administration (ITA) in partnership with TIA.
Previously held in 1997 and 1999 in China, the summit is considered a premier telecommunications and information technology event organized jointly by the two countries. The summit provides U.S. officials and company executives an opportunity to engage in dialogue on communications development in China, the world's largest and fastest-growing market. U.S. Department of Commerce Secretary Donald Evans and China's Ministry of Information Industry Minister Wang Xudong will lead the event. Other high-level officials, as well as Chinese provincial telecommunications authorities and other representatives of Chinese industry, will participate.
The 2004 summit marks the first time the event will be held in the United States. The meeting precedes SUPERCOMM 2004, June 20-24 at McCormick Place, and summit participants are invited by the TIA to attend the trade show and conference.
The TIA is based in Arlington, VA. For more information, visit www.tiaonline.org.
