Daniel Feldman is the Vice President of Business Development for Microsemi, a member of the HDBaseT Alliance PoH technical committee, and a member of ETSI ATTM TM6. He is the former chairperson of the Ethernet Alliance Power over Ethernet Technical Committee and was a member of the IEEE802.3at Task Force. Previously, Mr. Feldman worked at Microsemi and PowerDsine in several Sales, Business Development and Marketing roles, at IC4IC as System Architecture Manager, as a VHDL Engineer at NICE Systems and as VLSI Engineer at RAFAEL.
Mr. Feldman holds an MBA from UC Berkeley’s Haas Business School and a B.Sc. (Cum Laude) in Computer Engineering from the Technion in Haifa, Israel.
In his spare time Mr. Feldman is an amateur jazz singer and saxophone player.