Foxconn teams with Broadcom, MultiLane on 800G connectivity

March 14, 2022
The partner companies contend that the new generation of communication technology for enabling 5G/6G connectivity "realizes various possibilities of cloud applications, and also brings higher cloud transmission demand."

At this month's Optical Networking and Communication Conference & Exhibition (OFC 2022) exhibition in San Diego, Foxconn Interconnect Technology (FIT) jointly exhibited its QSFP-DD800 interconnection technology, incorporating Broadcom's low power Active Copper Cable (ACC) PHY (BCM87850) and MultiLane’s ML4039EN BERT.

The partner companies contend that the new generation of communication technology for enabling 5G/6G connectivity "realizes various possibilities of cloud applications, and also brings higher cloud transmission demand."

"The explosive growth of traffic requires higher bandwidth," continued the companies' statement. "800G is the fastest transmission speed in the market, which allows an upgrade of switch data rate from 12 Tbps to 25.6 Tbps / 51.2 Tbps."

“We are honored to cooperate with Broadcom and MultiLane to show our interconnect solution, and demonstrate its execution of our 5GAIoT strategy,” said Joseph Wang, CTO of FIT Hon Teng, who added, "Last year, we established a few new pillars of corporate priorities, and building the future of 5GAIoT is one of them."

MultiLane is a top developer of test platforms for 800G passive and active copper cables, as well as an enabler active silicon. The company says its portfolio of BERT, DSO and TDR products and solutions "offers unique capabilities that are crucial for the development of the 800G ecosystem."

“Our goal is to always be early to build innovative products and solutions in close collaboration with our partners, like Broadcom and FIT, that enable our customers to keep up with the bandwidth and performance requirements of today’s technological breakthroughs,” said Elias Khoury, Product Line Manager at MultiLane.

FIT noted that its QSFP-DD800 solution's innovative design not only supports data center companies, telecom operators, switch makers, server makers and test equipment operators, but also helps its customers to approach carbon neutrality. Via its 800G interconnect products immersion cooling technolgy, the company says its modules support lower energy and carbon consumption.

For more information, visit www.fit-foxconn.com.

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