The Telecommunications Industry Association has published a new joint standard, "Commercial Building Grounding (Earthing) and Bonding Requirements for Telecommunications."

The document, J-STD-607-A, was jointly developed by the TIA and the Alliance for Telecommunications Industry Solutions (ATIS).

The standard is designed to enable the planning, design and installation of telecommunications grounding and bonding systems with a building with or without prior knowledge of the telecommunications systems that will subsequently be installed. It also provides recommendations for grounding and bonding of customer-owned towers and antennas. This telecommunications grounding and bonding infrastructure supports a multi-vendor, multi-product environment as well as various system installation practices.

The joint TIA/T1 standard was produced by TIA/EIA Working Group 41.7.2 with ATIS T1E1.5 and T1E1.7. The standard was approved by TIA/EIA Technical Committees TR-41, ATIS Committee T1 and the American National Standards Institute.

To obtain copies of the document, contact Global Engineering Documents at (800) 854-7179 or visit www.global.ihs.com.