TIA revising 607 grounding and bonding standard to ‘C’ version

The TIA-607-C document will introduce a horizontal bonding backbone topology to accommodate today’s large, one-level telecom facilities.

The Telecommunications Industry Association’s (TIA) TR-42.16 Engineering Committee on Premises Telecommunications Bonding and Grounding recently issued a call for interest for the third revision of the grounding and bonding standard—document TIA-607-C—which is initially titled “Generic Telecommunications Grounding (Earthing) and Bonding for Customer Premises.”

According to the TIA, the TIA-607-C update will address the fact that “today’s large telecommunications facilities are built on one level.” The bonding backbone system specified in the current, 607-B, standard exhibits a vertical layout, the association explained. “This will be updated in the TIA-607-C release, which will introduce a horizontal bonding backbone topology to address this type of building. The new revision will also specify requirements for a generic telecommunications bonding and grounding infrastructure and its interconnection to electrical systems and telecommunications systems.”

Mark Harger, president of Harger Inc. and TR-42.16’s chair, commented, “For the past several years, the TR-42.16 subcommittee has done an excellent job updating TIA’s bonding and grounding standard. Since the first revision of ANSI/TIA J-STD-607-A, we have developed two annexes and one revision [607-B], and are now close to updating yet again to 607-C. Once completed, this standard will be more closely harmonized with international bonding and grounding practices as well as being more current with today’s construction practices.”

The revision also will harmonize the international and domestic standards, thereby reducing confusion within the market. When announcing the call for interest, the TIA commented, “Domestic and international codes and standards groups have been working on correcting terminology regarding bonding and grounding for approximately 10 years. Where there is confusion with bonding and grounding, electronic systems can fail. The improper grounding of separately derived systems can lead to equipment malfunction and other data issues. Once this new revision is completed, it may also be used as a guide for the renovation of existing systems.”

When issuing the call for interest, the TIA said stakeholders may include, among other professionals, architects, installers, building owners, electrical inspectors and electrical contractors. The association is actively seeking participation in this revision effort, and encourages interested parties to email Germaine Palangdao at standards@tiaonline.org.

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