UL and IWCS China 2018 symposium issues Call for Papers

The UL and IWCS China 2018 symposium committee has issued a Call for Papers for the regional Asian conference to be held in Shanghai, China on March 20-22, 2018.

UL and IWCS China 2018 symposium issues Call for Papers
UL and IWCS China 2018 symposium issues Call for Papers

The UL and IWCS China 2018 symposium committee has issued a Call for Papers for the regional Asian conference to be held in Shanghai, China on March 20-22, 2018 at the Shanghai International Convention Center.

Industry professionals are invited to participate in what is billed as "the world's most prestigious venue for technical papers and presentations serving the cable and connectivity industries." Abstracts for papers are sought from academic or industry professionals including subject matter experts, application solutions providers and product innovators in the various cable and connectivity industry segments worldwide. "Accepted papers will be widely disseminated with broad exposure opportunities for the topic, author and company to thousands of stakeholders internationally," adds UL and IWCS.

As further stated by a press announcement, "If your work is of interest to the worldwide cable and connectivity industry, then it should be presented at this conference. Accepted papers will be widely disseminated with broad exposure opportunities for the topic, author, and company to thousands of stakeholders internationally. In addition to the presentation at the symposium, accepted papers will be published in the symposium proceedings book and in the IWCS online archive. Several will be republished by IWCS in industry trade journals and papers may be republished by the author when authorized with IWCS permission. The author will also have the opportunity to participate in the IWCS Webinar Series, a free live presentation of papers with a global audience, which is recorded and archived on the IWCS website for downloading on demand."

Abstract deadline for papers is January 12, 2018.

Learn more and submit paper abstracts here.

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