SFP-DD MSA releases high-speed, high-density interface specification v2.0

Sept. 19, 2018
New specification's two-lane 3.5 W electrical interface enables high-speed enterprise networking; transceiver form factor doubles bandwidth and supports fast line rates, as well as backwards compatibility with existing SFP interfaces and new SFP-DD styles.

ROME -- The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group announces the release of the v2.0 specification for the SFP-DD pluggable interface.

Dedicated to fostering the development of next-generation SFP form factors used in DAC and AOC cabling, and optical transceivers, the MSA consortium released the initial SFP-DD specification version 1.0 in September 2017 and earlier this year released version 1.1.

The newly updated specification version 2.0 reflects enhancements to the mechanicals, extended modules and enhanced polarizing key of the high-speed, high-density SFP-DD electrical interface, targeting support of up to 3.5 W optical modules in an enterprise environment.

The SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers. The innovative electrical interface is designed to support two lanes that operate up to 25 Gbps NRZ or 56 Gbps PAM4 per lane modulation — providing aggregate bandwidth of 50 Gbps NRZ or 112 Gbps PAM4 with excellent signal integrity.

‘’Through strategic collaborations we work to increase speed, density and scalability in next-generation servers,” said Scott Sommers, Chair of the SFP-DD MSA. “We effectively enhance the roadmap in network applications to meet the challenging demands data centers and enterprise networking platforms are up against.”

It is anticipated that many MSA members will be demonstrating SFP-DD at the upcoming European Conference on Optical Communication, Sept 23rd-27th in Rome, Italy.

SFP-DD MSA founding members include Alibaba, Broadcom, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity. Contributing members are Accelink, Amphenol, AOI, Foxconn Interconnect Technology, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim, Multilane, Nokia, Oclaro, Senko, Source Photonics, US Conec, and ZTE.

To download the updated SFP-DD specification v2.0 and drawings or to explore opportunities for becoming a contributing member, please visit the MSA website www.sfp-dd.com.

Sponsored Recommendations

Power up your system integration with Pulse Power - the game-changing power delivery system

May 10, 2023
Pulse Power is a novel power delivery system that allows System Integrators to safely provide significant power, over long distances, to remote equipment. It is a Class 4 power...

The Agile and Efficient Digital Building

May 9, 2023
This ebook explores how intelligent building solutions can help businesses improve network infrastructure management and optimize data center operations in enterprise buildings...

400G in the Data Center

Aug. 3, 2022
WHATS NEXT FOR THE DATA CENTER: 400G and Beyond

Network Monitoring- Why Tap Modules?

May 1, 2023
EDGE™ and EDGE8® tap modules enable passive optical tapping of the network while reducing downtime and link loss and increasing rack space utilization and density. Unlike other...