Ventev Wireless Infrastructure, a unit of Tessco Technologies (NASDAQ: TESS), and the Venti Group, LLC have announced plans to collaborate and introduce high-performance distributed antenna systems (DAS) antennas and RF technologies that will meet carrier and enterprise demand for increased indoor 3G and LTE network coverage and capacity today and in the future.
“Venti Group chose to partner with Ventev and Tessco, because of their leading wireless position in North America, to exclusively bring to the North American market our DAS technology,” comments Hank Adamany, managing director of Venti Group. “Our partnership enables Ventev to expand the use of Venti technology in additional products in the future.”
With the ever increasing use of smartphones, tablets and other mobile devices, network operators in colleges, stadiums, corporate office buildings and city centers are tasked with providing next-generation cellular coverage and capacity both indoors and outdoors, as well as minimizing the contribution to noise levels introduced into the system as bandwidth needs increase. The RF technologies for DAS developed by Venti and incorporated into Ventev’s TerraWave antennas will solve these challenges, say the companies.
Ventev, a specialist in engineering-driven wireless products that support wireless radio deployments in enterprise environments, says it chose the Venti Group as a technology partner because of the company’s proficiency in low-PIM technologies, as well as its patented horizontal polarization RF technologies. Ventev will market, sell, and distribute these innovative products through Tessco Technologies.
“We are very enthusiastic about the partnership with the Venti Group and the antenna products we are creating that incorporate Venti technologies to solve complicated RF challenges,” concludes Jeff Lime, vice president of Ventev Wireless Infrastructure. “We look forward to sharing these exciting innovations with our customers in the near future.”