Germany's trans data elektronik GmbH (tde) and US Conec announced that the companies are strengthening their strategic partnership and offering organizations future-proof cabling infrastructures with high packing density for transmissions of up to 400G.
Cloud computing and hyperscale data centers fuel the demand for packing density and high bandwidth in data centers, notes the companies. To ensure that companies are prepared for these and future requirements, tde is continuously optimizing its modular tML cabling system for even higher fiber counts. The network expert also works closely with its strategic partners to achieve this.
As part of its latest technology partnership, tde announced that it has integrated the compact MDC connector from its long-standing partner US Conec into its tML system platform.
"As a technology leader for modular cabling solutions with the greatest packing density, companies can rely on us to provide them with the most compact system platforms on the market," says André Engel, Managing Director of tde. "We have always adhered to the motto: the more fibers available, the better. Now MDC connection technology is opening up new perspectives for us in high-density applications and energy efficiency in the patch area. This is the result of our long-standing, trusting partnership with US Conec."
tde's tML platform is a patented, modular cabling system consisting of three key components: the module, trunk cable and rack mount enclosure. The system components are 100 percent manufactured, pre-assembled and tested by tde in Germany. The company says the platform enables plug-and-play installation on site – especially in data centers, but also in industrial environments – within the shortest possible time. At the heart of the system are the rear-located MPO/MTP and telco connectors, which can be used to connect at least six or twelve ports at a time. The fiber-optic and TP modules can be used together in a module carrier with a very high port density.
In the system's rear area, tML cabling platform continues to rely on proven MPO technology based on the plug-and-play principle. In the patch area, it now integrates the MDC connector with two fibers. This allows a total of 384 fibers to be terminated on one height unit. This doubles the packing density compared to conventional LC duplex connectors, notes the companies. The new collaborative platform provides customers with among the highest packing density in the industry with single fiber connectors for high-density applications, they add.
The MDC connector based on the 1.25 m ferrule, which has a significantly smaller form factor than the LC duplex connector and offers three times the fiber density in the patch area. US Conec developed it for the new generation of transceiver device interfaces SFP-DD and QSFP-DD with transmission rates from 200 to 400G.
The single-fiber connector also includes the option for breakout applications. Network engineers can plug two (for SFP) or four (for QSFP) MDC patch cables into a transceiver and divide the transmission rates into channels with lower channel speeds. The advantage here is that the chassis of the active components can be used more efficiently with higher port numbers and packing densities.
Use of the MDC connector dramatically increases the scalable tML's systems packaging efficiency. The compact connector can accommodate up to 48 fibers in a tML module, as well as 192 x 2 fibers with a total of 384 fibers on one height unit – twice as many as when using LC duplex connectors and a number of ports that is four times higher than the industry standard.
The first projects using the tML system and MDC connection technology are already being implemented by tde at a major German research institute.
"We are delighted that network expert tde has chosen the MDC connector for their successful tML system platform in the patch area," says Ronald Habekothe, International Sales Manager, EMEA+ at US Conec. "Our goal is to be able to offer customers migration-proof high-density and high-speed networks. With the tML platform and the MDC connection technology, companies can be sure that they have found an investment-safe migration option up to 400G. We plan to continue to work closely with tde on strategic issues in the future.”
tde offers its tML cabling system in variants including tML Xtended, tML-24 and now tML-32 for extreme scalability and very easy migration to higher transmission rates such as 40G, 100G, 200G and 400G. US Conec is headquartered in Hickory, North Carolina, and is an equity venture of three leading communication technology companies—Corning Optical Communications, Fujikura, and NTT-AT.