Asetek picks up significant OEM contract for data center liquid cooling system

RackCDU removes heat from CPUs, GPUs, memory modules and other hot spots within servers, using an all-liquid path and rejecting the heat into ambient outdoor air without chilling.

Asetek wins $3.5M liquid cooling contract for 2 large-scale supercomputing data centers
Asetek wins $3.5M liquid cooling contract for 2 large-scale supercomputing data centers

Asetek (Oslo, Norway) announced that it has received a purchase order for its RackCDU data center liquid cooling system placed by FORMAT Sp. Ltd, an IT solutions provider located in Poland.

Building on the success of previous smaller orders, FORMAT has ordered 6 RackCDU with cooling loops for a total of 471 compute nodes that will be delivered in Q3. The order will result in revenue to Asetek in the range of $100K, according to a press statement.

“We are thrilled to add another regional OEM partner in such a short amount of time,” said André Sloth Eriksen, founder and CEO of Asetek. “We look forward to the opportunities that FORMAT will provide us to liquid cool HPC clusters in Poland.”

RackCDU is Asetek’s patented hot water, direct-to-chip, data center liquid cooling technology, which removes heat from CPUs, GPUs, memory modules and other hot spots within servers, using an all-liquid path and rejecting the heat into ambient outdoor air without chilling.

Asetek maintains that, as validated by Lawrence Berkeley National Labs, the RackCDU platform enables cooling savings in excess of 50%, density increases of 2.5x to 5.0x, and recovery of all the server energy removed by RackCDU for reuse in facility heating and cooling.

“FORMAT has seen terrific results from our previous smaller orders of Asetek’s liquid cooling solutions for our customers’ HPC clusters,” said Tomasz Mieszkowski, Vice President of FORMAT. “This larger order builds on our relationship and sets the stage for future opportunities inside Poland."

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