CommScope adds InstaPATCH 360 modular fiber platform to Systimax line

Oct. 6, 2009
Adding to its SYSTIMAX 360 line, CommScope Enterprise Solutions has introduced its InstaPATCH 360 system, a factory-terminated and -tested modular fiber connectivity platform optimized to provide simplified cable management while maximizing air flow within the data center.

October 6, 2009 – Adding to its SYSTIMAX 360 line, CommScope Enterprise Solutions has introduced its InstaPATCH 360 system, billed as a factory-terminated and -tested modular fiber connectivity platform that allows installers to simply and quickly connect system components together for improved density, performance and reliability.

According to the company, the InstaPATCH 360 system incorporates modules and pass-through panels which offer improved density, are reverse compatible with standard SYSTIMAX 360 shelves, and are “intelligence-ready.” The system’s trunk cables, fan-outs and array cords are constructed with a loose fiber cable design, minimizing stress on the optical fiber. In addition, the cable assemblies are terminated via CommScope’s patented process for applying the MPO connector to a round cable sub-unit.

Billed as smaller and more compact than its industry counterparts, each InstaPATCH 360 modular panel is also optimized to provide simplified cable management and maximize air flow within the data center. Other key features of the system, according to the company, include:

-- Incorporates the SYSTIMAX LazrSPEED, OptiSPEED and TeraSPEED fiber technologies (including the LazrSPEED 550 fiber, whose performance specifications are reflected in the recent OM4 standard) to support today’s most demanding applications, while allowing easy migration to next-generation technology.

-- Modules are equipped with translucent integrated dust covers that will help simplify connecting fiber components and can have up to 24 fibers.

-- Modular system approach enables up to 96 fibers to be ready for service in the time it takes to make a single fiber connection with traditional systems.

-- Compatibility with the SYSTIMAX G2 modular cassette system (and some SYSTIMAX InstaPATCH Plus components), providing customers with the capability to reduce shelf volume and achieve 96 LC connections in a one rack unit (1U) shelf.

-- For ultra high density solutions, the system’s MPO adapter panels and ruggedized fan-out or array cable assemblies can be used to reach a density of 384 fibers in one rack unit (1U) shelf. The 4U modular shelf can accommodate 1152 fibers. CommScope plans to extend the 4U Modular Panel fiber count to 1536 fibers before the year’s end.

“Our SYSTIMAX 360 products seamlessly integrate copper, fiber and intelligence to form the ultimate network infrastructure solution,” comments Luc Adriaenssens, senior vice president, R&D and Technology, CommScope Enterprise Solutions. “With the addition of InstaPATCH 360, data center designers now have a system that further improves density and system performance in the data center while keeping costs lower–completely redefining expectations for the data center.”

“InstaPATCH 360, like our original InstaPATCH Plus system, enables installers to simply and quickly connect system components together,” adds Kevin Paschal, product manager, Fiber Optic Solutions, CommScope Enterprise Solutions. “However, the new solution comes equipped with design features that provide enhanced cable management capabilities while minimizing restrictions to air flow that is vital for cooling. Ultimately, with InstaPATCH 360, we are reducing the bulk of system components, improving the life of electronics and reducing power consumption and system costs throughout the data center – all considerations that are vital in today’s data center environment.”

The InstaPATCH 360 System will have its first public appearance at the IP Expo 2009 in London on October 7. The solution will also be featured, in addition to the other SYSTIMAX 360 solutions, as part of the CommScope 360 Roadshow Series, which kicks off in Los Angeles on October 13, and will travel to 13 cities in the North America region, designed to showcase the company’s latest innovations in copper, fiber and intelligent network infrastructure solutions.

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