nVent offers a rack that complies with Open Compute Project’s (OCP) Open Rack Version 3 (ORV3) specifications. Featuring dimensions of 2286 mm (H) x 600 mm (W) x 1068 mm (D), the OCP ORV3 Rack offers capacity of 44 units and up to 1400 kilograms (~3086 pounds).

Its 21-inch internal width is convertible to 19-inch RUs, and the vertical 48V DC busbar supports up to 18 kW per shelf, or 120 kW in high-power setups.

“nVent collaborates with the Open Compute Project to design scalable, AI-ready liquid cooling and power infrastructure for hyperscale data centers,” the company explains on a page of its website that describes its OCP-compliant infrastructure. “Built to OCP specifications, including Google’s Project Deschutes 5.0, nVent solutions deliver efficient thermal management and reliable power distribution to support the most demanding AI and accelerated computing workloads.”

nVent is an official contributor and corporate member of the Open Compute Project. Its involvement spans specifications, compliant hardware (including the rack described on this page), and the OCP solution-provider network. It is an official specification author/contributor alongside companies including Meta on OCP standards, including the Open Rack V3 Blind Mate Manifold Specification.

The Open Compute Project develops open-source design concepts that any manufacturer or end-user can contribute to, driving innovation toward off-the-shelf, easy-to-source solutions across the entire data center. Because all OCP solutions are cross-compatible within the OCP universe, they can be deployed rapidly and sustainably at scale. Also because OCP designs are open source, any manufacturer can build the products. nVent notes: “The competitive edge comes from turning the reference designs into hardware that can be manufactured rapidly and at huge scale, a new way of looking at the entire IT ecosystem, from how equipment is deployed, to how it is powered, to how it is cooled.”