Conducted the week of April 29, 2019 at the University of New Hampshire InterOperability Laboratory (UNH-IOL) in Durham, NH, the members-only test event included equipment with capability ranging from 25 Gigabit per second (Gb/s) to 400 Gb/s data rates. With pass rates of greater than 97 percent, the recent Plugfest highlighted the key role multivendor interoperability plays in Ethernet’s continued success, said the consortium.
The third in its ongoing series, the Ethernet Alliance HSN Plugfest drew participation from 13 diverse member companies representing all aspects of the Ethernet ecosystem. Addressing the need for enabling emerging technologies, the member companies supplied products and solutions spanning speeds of 25 Gigabit Ethernet (GbE) up to 400GbE, which were tested in various form factors such as OSFP, QSFP, and QSFP-DD. Equipment undergoing testing included both electrical and optical interconnects; new signaling and modulation technologies; switches and NICs; cabling; and test and measurement solutions and methodologies.
The Ethernet Alliance said its HSN Plugfest test results showed consistent improvement over previous events, with Frame Error Rate (FER) tests producing a remarkable 100 percent pass rate, and functional interoperability tests achieving an aggregated 97.5 percent pass rate.
Offering a competitive advantage exclusively for members, Ethernet Alliance Plugfests provide a neutral, secure testing environment. Among the companies taking part in the recent event were Amphenol Corporation (NYSE: APH); Anritsu Corporation (TYO: 6754); Arista Networks, Inc. (NYSE: ANET); Credo Semiconductor, Inc.; EXFO, Inc. (NASDAQ: EXFO); Fluke Corporation (NYSE: FTV); HG Genuine Co., Ltd.; Intel Corporation (NASDAQ: INTC); The Siemon Company; Spirent Communications plc (LSE: SPT); Tektronix, Inc.; Teledyne LeCroy, Inc. (NYSE: TDY); and Wilder Technologies, LLC.
The next HSN Plugfest, open exclusively to Ethernet Alliance members, is scheduled for October 2019 at UNH-IOL’s state of the art facility. Companies interested in taking advantage of the benefits these test events provide are encouraged to secure participation through membership in the organization. Additionally, select technologies tested during the plugfest will be on display during the Ethernet Alliance’s live, multivendor demo in booth 134 at the 45th European Conference on Optical Communication (ECOC 2019) in Dublin, Ireland.
“This latest Ethernet Alliance Plugfest was a valuable opportunity for testing of both pre-release and market-ready products and solutions against IEEE standards in a confidential, non-competitive environment," commented Dave Chalupsky, plugfest chair and board of directors member, Ethernet Alliance; and network product architect, Intel Corporation. "The substantial turnout among member companies and high volume of successful tests speaks to Ethernet’s enduring legacy of continuous improvement. Ethernet’s hallmark multivendor interoperability makes it ideal for addressing global demand for higher-speed connectivity. Test events like this are the key to unleashing that interoperability, so we’re definitely looking forward to our next HSN Plugfest in October 2019.”
For more information about the Ethernet Alliance, visit http://www.ethernetalliance.org.