Data Center

Jointly developed 112Gbps PAM4 jumper cable interconnect boosts 5G data networking

March 23, 2022

First showing at DesignCon 2022 (April 5-7), Japanese firms Yamaichi and JAE have jointly developed a new 112Gbps jumper cable interconnect product aimed at the next-gen data networking market being propelled by 5G/6G mobile technology development.

Matt Vincent

Left: HOST to OSFP, Right: HOST to HOST; 112Gbps Jumper Cable Interconnect product

Tokyo technology companies Yamaichi Electronics Co., Ltd. and Japan Aviation Electronics Industry, Ltd. (JAE) have jointly developed a prototype of a high-speed jumper cable interconnect product which supports 112Gbps PAM4 signaling on data networking systems.

Yamaichi is a specialist in high speed connectors for the data networking market and contributor to global industry standard organizations' activities. JAE is a global provider of connector and cable harness products for a wide range of market segments, including the 5G data networking market.

Synergizing the capabilities of both companies, Yamaichi and JAE developed the new product together and said they will make it available in 2022.

5G pushing data speeds

The companies contend that the demand for performance enhancement of data transmission speeds on network equipment such as routers and switches is only increasing with the expansion of 5G networking and the rapid progress of 5G/6G technology development. To fulfill such market demand, the two companies combined their design expertise to develop this new interconnect, especially designed to meet new networking performance and reliability expectations.

The partners contend that, as requirements for data transmission speed are reaching the upper limit of existing printed circuit board (PCB) technologies, it is becoming more difficult to realize constant and reliable data transmission performance. To solve this problem, the companies jointly developed this jumper cable interconnect, which can support stable data transmission at 112Gbps PAM4 signaling.

The interconnect has been designed with a compact connector size, to be able to fit inside high density design requirements, and supports various usages, including direct jumper cabling from front panel pluggable IO to host chip, and internal chip-to-chip connection.

The product will be demonstrated at Yamaichi's booth #960 at DesignCon 2022 from April 5-7 in Santa Clara, CA.

About the Author

Matt Vincent | Senior Editor

Matt Vincent is a B2B technology journalist, editor and content producer with over 15 years of experience, specializing in the full range of media content production and management, as well as SEO and social media engagement best practices, for both Cabling Installation & Maintenance magazine and its website CablingInstall.com. He currently provides trade show, company, executive and field technology trend coverage for the ICT structured cabling, telecommunications networking, data center, IP physical security, and professional AV vertical market segments. Email: [email protected]