CEDIA opens 2021 US Tech Summits, 1-day live events go through December

Oct. 5, 2021
CEDIA's 2021 US Tech Summits are free, in-person informative seminars discussing and exhibiting upcoming CEDIA integrator technology and future trends in the custom installation industry, including Pro AV and other residential systems technologies.

CEDIA, the global trade association and education and training expert for the residential technology integration industry, has opened the doors for its series of 2021 U.S. Tech Summits.

The free, one-day events feature opportunities for the residential system integration industry to meet face-to-face, attend informative seminars on upcoming technology and future trends, and see some of the latest product offerings from a range of manufacturers.

CEDIA's 2021 U.S. Tech Summits include the following events:

The links above lead to full registration information. The inaugural Oct. 5 Irvine Tech Summit today in Irvine, CA provides attendees with free informative seminars regarding upcoming CEDIA integrator technology and future trends in the custom residential installation industry.

The event also features product displays from over 30 manufacturers, highlighting their latest and most exciting products. View a list of the event's Presenting Sponsors.

Per CEDIA, each Tech Summit kicks off with a keynote presentation from Google on “The Thoughtful Home.”

The first 50 integrators to arrive at each event will receive a Google Home Mini.

In addition to providing the opening keynote, representatives from CEDIA, CinemaTech, Barco, Qmotion, Kinetics Noise Control, and others offer training at the events.

The CEDIA Tech Summits also feature over 55 industry-leading manufacturers presenting hands-on demonstrations of their latest product offerings. Complimentary coffee service and lunch is provided.

To register for one of CEDIA’s Tech Summits, visit the association website. Please note that masks are required throughout the events for all participants.

View a list of upcoming CEDIA events.

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